Finally: UPPER: should we change shape of UPPER PCB to be flush with
*outside* of case? It seems feasible to simply have a nice finish
on the PCB edge and make that (part of) our "spacer
frame". The "height" above LOWER seems to fit to the
micron. Would also better support the kbd area to avoid bending of
PCB (and thus not causing mech pressure/force to high components on
LOWER: modem) when pushing a kbd switch/key. Otherwise we might need
mech support posts soldered to UPPER and protruding through holes in
LOWER to the battery bay steel, since modem and other large BGA
components MUST NOT get mechanical force bending/pushing them down.


Kommentar 10 von Joerg Reisenweber, Dez 23, 2013

just a further maybe not so spleeny idea: when UPPER creates part of
our spacer frame's outer surface, we should of course have it plated
by gold. And when we already have gold there, why not make this a
few contact pads for e.g. charger-cradle pogo-pins to contact there.
The CRTouch chip's 4 capacitive sensor "buttons" are
another thing that comes to mind. I suggest to have equally spaced
and sized separate gold-plated contacts of maybe 5mm length all
around the perimeter/edge of 0.8mm high UPPER, and use some of them for
predefined assigned functions like charging, leaving the others for
our hw-hacker customers by routing them to solder pads nearby and
maybe even some of them via B2B to LOWER and there to expansion
connectors.

Kommentar 11 von Joerg Reisenweber, Dez 23, 2013

HDMI goes there?

Kommentar 12 von Joerg Reisenweber, Dez 23, 2013

now it takes me away I guess: how about separating above mentioned
5mm * 0.8mm gold pads by LEDs embedded flush into PCB edge? LEDs with 0.8mm
height and some 1.2mm length would nicely separate the 0.8mm high
gold pads by 1.3..1.4mm