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2010-02-26
, 19:06
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Posts: 147 |
Thanked: 228 times |
Joined on Feb 2010
@ Toronto, Canada
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#21
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2010-02-26
, 19:14
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Posts: 306 |
Thanked: 566 times |
Joined on Jan 2010
@ Romania
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#22
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2010-02-26
, 19:25
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Posts: 147 |
Thanked: 228 times |
Joined on Feb 2010
@ Toronto, Canada
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#23
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SnPb solder alloy ( 63%-37%) melting point 183 oC
I filled around usb green solder mask to uncover copper layer and solder a little bit more

Seriously, from what I could tell, that upper PCB is sandwiched between the main PCB (system board) and the plastic casing of the phone. It's as solid as it'll get, as it's held tight by the LCD screws.
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2010-02-26
, 19:39
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Posts: 1,345 |
Thanked: 1,857 times |
Joined on Jan 2009
@ fr/35/rennes
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#24
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2010-02-26
, 19:39
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Posts: 306 |
Thanked: 566 times |
Joined on Jan 2010
@ Romania
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#25
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2010-02-26
, 19:49
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Posts: 147 |
Thanked: 228 times |
Joined on Feb 2010
@ Toronto, Canada
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#26
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what silver line ? i don't understand . edit the picture and mark it.
around pads is copper ground plane and pads are separated from this layer because this layer dissipate heat in solder process and final solder can become "cold" . in all designs ground pads obey this rule
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2010-02-26
, 19:56
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Posts: 137 |
Thanked: 170 times |
Joined on Jul 2008
@ Szczecin, Poland
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#27
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2010-02-26
, 19:59
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Posts: 306 |
Thanked: 566 times |
Joined on Jan 2010
@ Romania
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#28
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2010-02-27
, 02:25
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Posts: 90 |
Thanked: 47 times |
Joined on Dec 2009
@ Sydney Australia
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#29
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2010-02-28
, 01:41
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Posts: 74 |
Thanked: 38 times |
Joined on Feb 2010
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#30
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